intel 300mm_45mm wafer

 

It is a significant and far-reaching process of transition to the use of large diameter substrates, very difficult to implement by a single enterprise, even if it is a leader in the industry. Despite the fact that the transition from 300 - to 450 mm - mm substrates in the long run will reduce the cost of manufacturing one chip, re-production capacity requires very substantial cash investments and, more over, also can not do without the support of a new industry standard by partners industry. Meanwhile, greater weight joint statement Intel, Samsung Electronics and TSMC, declared the agreement on the transition to 450 - mm wafer, which is scheduled to start in 2012

Reported that the total surface area of 450 - mm wafer crystals and the number of printed integrated circuits in more than 2 times higher than the corresponding figures for 300 - mm substrates. Moreover, the transition to a larger diameter wafer would reduce emissions of harmful substances and used in the production of water, thereby reducing damage to the environment factories for the manufacture of semiconductor products.

Intel, Samsung and TSMC note that the semiconductor industry may increase the return on investment in their investment and substantially reduce the costs of research and technology development 450 - mm substrates through the use of agreed standards, changes in infrastructure and optimize industrial automation 300 - mm substrates, as well as carry out general timetable. Companies also believe that the approach from the perspective of cooperation will help to minimize the risks and costs associated with the transition to new technology. Companies announced their intention to continue cooperation with the International consortium Sematech (ISMI), as the organization plays a crucial role in coordinating the efforts of the industry in question supply 450 - mm substrates, determining standards, as well as the development of test stands for equipment.