The Japanese company Toshiba remains one of the largest world producers of integrated circuits, but this role requires an ongoing modernization of their production capacity, which should produce at increasingly low cost. This is especially true market integrated circuits flash memory experiencing not the best times in connection with the constant decline in the value of microchips, and hence declining profitability flash business. That is why in the immediate plans of the company Toshiba is the transition to the use of 300 - mm silicon wafers instead of 200 - mm.

Both procedures - declining share of equipment, working with 200 - mm “semi”, and increasing the number “300 - mm” machines go in parallel mode. Thus, according to the most recent figures, the company Toshiba plans to reduce output volumes of semiconductor products at Yokkaichi Operations factory capacity of 200 - mm wafers, at 60%. But completely abandon the appropriate equipment is not planned - it will be constructed a number of specialized chips, in particular, MCP-solutions (Multi-Chip Package - unite in one case a few crystals of integrated circuits).

Reported that the main supplier of equipment is the company FlashVision, which is then used as a factory at Yokkaichi Operations, and at several other factories owned by Toshiba. Simply become unnecessary equipment is sold to interested companies.