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Entries for the ‘Intel Product’ Category

Wheels Intel High Performance SSD platform for Centrino 2

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According to information leaked to press Taiwanese manufacturers of notebook PCs, one of the components of the coming upgrade Intel Centrino mobile platform 2, which is before the announcement working title Montevina, will drive for flash memory - SSD (Solid State Drives). Moreover, Intel plans to start deliveries in time for a new generation of […]

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The first UMPC-based Intel Atom - Latest News

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Some foreign online retailers are already beginning to take pre-orders for the new generation of devices built UMPC-based platforms Intel Atom. At the moment, aware that one of the first to arrive in retail sales Gigabyte M528. This is the standard in the hull UMPC form factor slider equipped with a processor Intel Atom frequency […]

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Google will translate its servers to storage SSD-Intel

 
Solid drives (SSD) gradually approved in the segment of mobile computers as an alternative to traditional hard disks. However, the server market producers SSD-vision devices are less promising. If you believe this authoritative source of Taiwan, one of the following achievements of the company Intel will be linked from a segment of server systems. With […]

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A new generation of Intel Core 2 Duo E7000 family released - Hardware Review

Intel in the fourth quarter of 2007 released a new 45-nanometer process technology processor, code-named Penryn, including a dual-core desktop processor Wolfdale, quad-core desktop processor Yorkfield. However, six months after the 45-nm, is mainly directed against the mainstream level and above processors, the following entry is still used 65-nanometer process, Intel has formally issued new […]

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X58 first Nehalem chipset From Intel- Technology news

 
Although much Intel has been delayed by the 45nm quadcores it is nevertheless convinced that the new series processors, namely the Nehalem, still in the last quarter of this year on the market. The desktop variant this, the Bloomfield, will have four cores and a shared cache of 8 MB. In addition, the Bloomfield also […]

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Intel, Samsung and TSMC have agreed on the transition to 450 - mm wafer

 
It is a significant and far-reaching process of transition to the use of large diameter substrates, very difficult to implement by a single enterprise, even if it is a leader in the industry. Despite the fact that the transition from 300 - to 450 mm - mm substrates in the long run will reduce the […]

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